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Proper PV labeling: How to install a PV system that meets IFC/NEC labeling standards

Todd Fries, HellermannTyton, describes recent fire and electrical codes that affect solar PV installations, debunking some myths and describing what installers need to know to pass inspection and properly label PV systems.

Apple spends most on semiconductors; 61% for wireless products

Apple bought the most semiconductors of all OEMs in 2010, largely to build iPhones and iPads, according to IHS iSuppli research. This is Apple's first trip to the #1 spot, after being third in 2009 and sixth in 2008.

FEI plasma FIB tool targets packaging apps

FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

Gas-based etch enables MEMS materials flexibility, commercial reliability at Fraunhofer

Fraunhofer IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.

Quantum dot laser grown on silicon substrate

UCL and the London Centre for Nanotechnology researchers have demonstrated an electrically driven, quantum dot laser grown directly on a Si substrate, with a 1300nm wavelength suitable for telecom.

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Why Measuring Solar Simulators Is Important
Measurement of a solar simulator is a very important task and should be completed at least every 3 months. Lamps and power outputs of simulators change over time ...
Silver Price Control: New Materials Technology Helps Mitigate Silver?s Rising Cost
With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manage the ...
Sponsored By:  Henkel Corporation
Testing the Reliability and Safety of Photovoltaic Modules: Failure Rates and Temperature Effects
Photovoltaic modules are designed to meet the reliability and safety requirements of national and international test standards. Qualification testing is a short-duration ...
Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints ...
Sponsored By:  Henkel Corporation
Stop Struggling with High-Voltage Capacitance Measurement!
The input, output and reverse transfer capacitance of power MOSFETS (Ciss, Coss and Crss respectively) are critical device parameters for switching applications. ...
Sponsored By:  Agilent

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Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ...
Sponsored By:  Master Bond, Inc.,
ElectroIQ Blog
the editors of ElectroIQ.com
by the editors of ElectroIQ.com

Read opinions/analysis on the day's news, tradeshow updates, and more. We blog about solar, semiconductor, advanced packaging and nanotech manufacturing industries.

Entegris tour covers the leading edge of filtration, 450mm, and the importance of collaboration


Semiconductor and display fab trends gleaned from AMAT's Analyst Day


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Insights from the Leading Edge
Dr. Phil Garrou
by Dr. Phil Garrou

Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

IFTLE 89 Advances in CMOS Image Sensing

It was 5 years ago in the the fall of 2007 when Toshiba first announced the commercialization of TSV in a CMOS image sensor (CIS) [see "PFTLE 12 Imaging Chips with TSV announced..."; PFTLE 16, "More TSV Commercial capacity on line"; PFTLE 24, "ST Micro...

Chipworks Real Chips Blog
Dick James
by Dick James

DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.

GLOBALFOUNDRIES' Ajit Manocha Visits Vegas for CES

GLOBALFOUNDRIES has hosted a reception for the last three years at CES, although they don't exhibit there, or even take a suite for the show - they find it a useful way to connect with customers and the analyst and journalist community. Held on CES...

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ElectroIQ, the portal for electronics manufacturing, is the home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging) and Small Times (nanotech/MEMS). These publications cover manufacturing technology, business news for major companies, trade events, and more.


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